Equipment Processing Principle:

The picosecond laser beam is emitted with a pulse transmission speed of <10 picoseconds. After beam shaping and amplification, it is refracted to the cutting head, generating a focused beam of <2μm. This beam acts on the material stably adsorbed on the platform. Under the control of a high-precision motion controller, the platform moves according to the dimensional graphic trajectory required by the customer, forming a cutting line to complete the processing.

Applications:

Tempered and Non-tempered Glass Cutting:

Mobile phone glass covers, vehicle-mounted glass covers, camera glass covers, etc.

Sapphire Glass Cutting:

Mobile phone sapphire covers, camera sapphire glass covers, sapphire light bars (LED light bars), etc.

Other Optical Glass Cutting:

Filter cutting, mirror cutting, etc.

Equipment Advantages & Performance Features:

High-power picosecond laser as the light source.

Specialized glass cutting head with imported U.S. lenses, featuring a fine light spot, long focal depth, minimum focused spot <2μm, and focal depth up to 15mm.

The motor platform and optical platform base are made of natural marble, processed by secondary fine grinding for high precision.

X/Y-axis motors adopt high-end linear motors, German 0.1μm digital grating rulers, Taiwanese lead screws and guide rails—high-quality core motion components ensuring 24-hour fault-free operation.

High-negative pressure vacuum pump adsorbs products to ensure positioning stability.

Equipped with alignment CCD and telecentric vision lenses for precise identification of Mark points (e.g., circles, crosses).

Electrical components use Schneider (France), and switching power supplies use Mean Well (Taiwan).

Powerful cutting software supports integrated cutting and cleaving, independent cutting, and independent cleaving. It can be flexibly operated via start buttons on both sides of the left-right platform.